This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.
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This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.
Imprint | Springer-Verlag New York |
Country of origin | United States |
Series | Integrated Circuits and Systems |
Release date | September 2008 |
Availability | Expected to ship within 12 - 17 working days |
First published | November 2008 |
Editors | Chuan Seng Tan, Ronald J. Gutmann, L. Rafael Reif |
Dimensions | 235 x 155 x 23mm (L x W x T) |
Format | Hardcover |
Pages | 410 |
Edition | 2009 ed. |
ISBN-13 | 978-0-387-76532-7 |
Barcode | 9780387765327 |
Categories | |
LSN | 0-387-76532-8 |