This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.
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This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.
Imprint | Springer-Verlag New York |
Country of origin | United States |
Series | Integrated Circuits and Systems |
Release date | December 2010 |
Availability | Expected to ship within 10 - 15 working days |
First published | 2009 |
Editors | Chuan Seng Tan, Ronald J. Gutmann, L. Rafael Reif |
Dimensions | 235 x 155 x 19mm (L x W x T) |
Format | Paperback |
Pages | 410 |
Edition | 1st ed. Softcover of orig. ed. 2009 |
ISBN-13 | 978-1-4419-4562-4 |
Barcode | 9781441945624 |
Categories | |
LSN | 1-4419-4562-8 |