Microscale Heat Transfer - Fundamentals and Applications - Proceedings of the NATO Advanced Study Institute on Microscale Heat Transfer - Fundamentals and Applications in Biological and Microelectromechanical Systems, Cesme-Izmir, Turkey, 18-30 July, 2004 (Hardcover, 2005 ed.)


This volume contains an archival record of the NATO Advanced Institute on Microscale Heat Transfer - Fundamental and Applications in Biological and Microelectromechanical Systems held in Cesme - Izmir, Turkey, July 18-30, 2004. The ASIs are intended to be high-level teaching activity in scientific and technical areas of current concern. In this volume, the reader may find interesting chapters and various Microscale Heat Transfer Fundamental and Applications. The growing use of electronics, in both military and civilian applications has led to the widespread recognition for need of thermal packaging and management. The use of higher densities and frequencies in microelectronic circuits for computers are increasing day by day. They require effective cooling due to heat generated that is to be dissipated from a relatively low surface area. Hence, the development of efficient cooling techniques for integrated circuit chips is one of the important contemporary applications of Microscale Heat Transfer which has received much attention for cooling of high power electronics and applications in biomechanical and aerospace industries. Microelectromechanical systems are subject of increasing active research in a widening field of discipline. These topics and others are the main themeof this Institute."

R8,762

Or split into 4x interest-free payments of 25% on orders over R50
Learn more

Discovery Miles87620
Mobicred@R821pm x 12* Mobicred Info
Free Delivery
Delivery AdviceShips in 12 - 17 working days



Product Description

This volume contains an archival record of the NATO Advanced Institute on Microscale Heat Transfer - Fundamental and Applications in Biological and Microelectromechanical Systems held in Cesme - Izmir, Turkey, July 18-30, 2004. The ASIs are intended to be high-level teaching activity in scientific and technical areas of current concern. In this volume, the reader may find interesting chapters and various Microscale Heat Transfer Fundamental and Applications. The growing use of electronics, in both military and civilian applications has led to the widespread recognition for need of thermal packaging and management. The use of higher densities and frequencies in microelectronic circuits for computers are increasing day by day. They require effective cooling due to heat generated that is to be dissipated from a relatively low surface area. Hence, the development of efficient cooling techniques for integrated circuit chips is one of the important contemporary applications of Microscale Heat Transfer which has received much attention for cooling of high power electronics and applications in biomechanical and aerospace industries. Microelectromechanical systems are subject of increasing active research in a widening field of discipline. These topics and others are the main themeof this Institute."

Customer Reviews

No reviews or ratings yet - be the first to create one!

Product Details

General

Imprint

Springer-Verlag New York

Country of origin

United States

Series

NATO Science Series II: Mathematics, Physics and Chemistry, 193

Release date

April 2005

Availability

Expected to ship within 12 - 17 working days

First published

2005

Editors

, , ,

Dimensions

232 x 156 x 28mm (L x W x T)

Format

Hardcover

Pages

509

Edition

2005 ed.

ISBN-13

978-1-4020-3359-9

Barcode

9781402033599

Categories

LSN

1-4020-3359-1



Trending On Loot