In this revised edition they have therefore expanded their treatment of hybrid circuits without finding it necessary to change the fundamentals. They have included a separate chapter on multichip modules and throughout the book have included new and emerging materials and processes that are beginning to be used. Examples include: metal-matrix composites and aluminum nitride as substrate materials, plastic encapsulated microcircuits and chip-on-board as low-cost alternatives to hermetic sealed packages, atmospheric friendly cleaning solvents and methods, and advanced high I/O density quad flat packages (QFP) and ball grid array (BGA) packages. Since the first edition, there have also been tremendous advances in software programs for thermal and electrical analysis and these are also treated in this new edition.
The abbreviated Table ofContents below includes the chapter titles and selected sub-headings.
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In this revised edition they have therefore expanded their treatment of hybrid circuits without finding it necessary to change the fundamentals. They have included a separate chapter on multichip modules and throughout the book have included new and emerging materials and processes that are beginning to be used. Examples include: metal-matrix composites and aluminum nitride as substrate materials, plastic encapsulated microcircuits and chip-on-board as low-cost alternatives to hermetic sealed packages, atmospheric friendly cleaning solvents and methods, and advanced high I/O density quad flat packages (QFP) and ball grid array (BGA) packages. Since the first edition, there have also been tremendous advances in software programs for thermal and electrical analysis and these are also treated in this new edition.
The abbreviated Table ofContents below includes the chapter titles and selected sub-headings.
Imprint | William Andrew Publishing |
Country of origin | United States |
Release date | December 1998 |
Availability | Expected to ship within 12 - 17 working days |
First published | 1999 |
Authors | James J. Licari |
Dimensions | 229 x 152 x 33mm (L x W x T) |
Format | Hardcover |
Pages | 600 |
Edition | 2nd edition |
ISBN-13 | 978-0-8155-1423-7 |
Barcode | 9780815514237 |
Categories | |
LSN | 0-8155-1423-9 |