Thorough emphasis is placed on the physical interpretation of fundamental concepts, development of theoretical models and exploration of their applications to fracture characterization in the presence of magneto-electro-thermo-mechanical coupling and dissipative effects. Mechanical, aeronautical, civil, biomedical, electrical and electronic engineers interested in application of the principles of fracture mechanics to design analysis and durability evaluation of smart structures and devices will find this book an invaluable resource.
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Thorough emphasis is placed on the physical interpretation of fundamental concepts, development of theoretical models and exploration of their applications to fracture characterization in the presence of magneto-electro-thermo-mechanical coupling and dissipative effects. Mechanical, aeronautical, civil, biomedical, electrical and electronic engineers interested in application of the principles of fracture mechanics to design analysis and durability evaluation of smart structures and devices will find this book an invaluable resource.
Imprint | Imperial College Press |
Country of origin | United Kingdom |
Release date | December 2012 |
Availability | Expected to ship within 10 - 15 working days |
First published | 2013 |
Authors | Xiaohong Chen, Yiu-Wing Mai |
Dimensions | 234 x 155 x 22mm (L x W x T) |
Format | Hardcover |
Pages | 328 |
Edition | New |
ISBN-13 | 978-1-84816-663-9 |
Barcode | 9781848166639 |
Categories | |
LSN | 1-84816-663-X |