This useful book addresses electrothermal problems in modern VLSI systems. It discusses electrothermal phenomena and the fundamental building blocks that electrothermal simulation requires. The authors present three important applications of VLSI electrothermal analysis: temperature-dependent electromigration diagnosis, cell-level thermal placement, and temperature-driven power and timing analysis.
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This useful book addresses electrothermal problems in modern VLSI systems. It discusses electrothermal phenomena and the fundamental building blocks that electrothermal simulation requires. The authors present three important applications of VLSI electrothermal analysis: temperature-dependent electromigration diagnosis, cell-level thermal placement, and temperature-driven power and timing analysis.
Imprint | Springer |
Country of origin | Netherlands |
Release date | June 2000 |
Availability | Expected to ship within 12 - 17 working days |
First published | 2002 |
Authors | Yi-Kan Cheng, Ching-Han Tsai, Chin-Chi Teng, Sung-Mo Steve Kang |
Dimensions | 235 x 155 x 14mm (L x W x T) |
Format | Hardcover |
Pages | 210 |
Edition | 2002 ed. |
ISBN-13 | 978-0-7923-7861-7 |
Barcode | 9780792378617 |
Categories | |
LSN | 0-7923-7861-X |