Electromigration Inside Logic Cells - Modeling, Analyzing and Mitigating Signal Electromigration in NanoCMOS (Paperback, Softcover reprint of the original 1st ed. 2017)

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This book describes new and effective methodologies for modeling, analyzing and mitigating cell-internal signal electromigration in nanoCMOS, with significant circuit lifetime improvements and no impact on performance, area and power. The authors are the first to analyze and propose a solution for the electromigration effects inside logic cells of a circuit. They show in this book that an interconnect inside a cell can fail reducing considerably the circuit lifetime and they demonstrate a methodology to optimize the lifetime of circuits, by placing the output, Vdd and Vss pin of the cells in the less critical regions, where the electromigration effects are reduced. Readers will be enabled to apply this methodology only for the critical cells in the circuit, avoiding impact in the circuit delay, area and performance, thus increasing the lifetime of the circuit without loss in other characteristics.

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Product Description

This book describes new and effective methodologies for modeling, analyzing and mitigating cell-internal signal electromigration in nanoCMOS, with significant circuit lifetime improvements and no impact on performance, area and power. The authors are the first to analyze and propose a solution for the electromigration effects inside logic cells of a circuit. They show in this book that an interconnect inside a cell can fail reducing considerably the circuit lifetime and they demonstrate a methodology to optimize the lifetime of circuits, by placing the output, Vdd and Vss pin of the cells in the less critical regions, where the electromigration effects are reduced. Readers will be enabled to apply this methodology only for the critical cells in the circuit, avoiding impact in the circuit delay, area and performance, thus increasing the lifetime of the circuit without loss in other characteristics.

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Product Details

General

Imprint

Springer International Publishing AG

Country of origin

Switzerland

Release date

July 2018

Availability

Expected to ship within 10 - 15 working days

First published

2017

Authors

, ,

Dimensions

235 x 155 x 8mm (L x W x T)

Format

Paperback

Pages

118

Edition

Softcover reprint of the original 1st ed. 2017

ISBN-13

978-3-319-84041-3

Barcode

9783319840413

Categories

LSN

3-319-84041-X



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