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Jenny Stanford Publishing
Mdpi AG
Springer London
Springer Verlag, Singapore
Woodhead Publishing Ltd
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Reliability Analysis of Electrotechnical Devices (Hardcover)
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1,394
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R
533
Theory and Practice of Quality and Reliability Engineering in Asia Industry (Hardcover, 1st ed. 2017)
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7,218
R
6,685
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R
299
Simulated Annealing (Hardcover)
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4,407
R
4,108
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Graphene and VLSI Interconnects (Hardcover)
Cher Ming Tan
,
Udit Narula
,
Vivek Sangwan
R
3,556
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Electromigration In Ulsi Interconnections (Hardcover)
Cher Ming Tan
R
3,085
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Theory and Practice of Quality and Reliability Engineering in Asia Industry (Paperback, Softcover reprint of the original 1st ed. 2017)
R
5,858
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Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections (Hardcover, 2011 Ed.)
Cher Ming Tan
,
Wei Li
,
Zhenghao Gan
,
Yuejin Hou
R
3,001
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Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections (Paperback, 2011 ed.)
Cher Ming Tan
,
Wei Li
,
Zhenghao Gan
,
Yuejin Hou
R
2,961
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Reliability and Failure Analysis of High-Power LED Packaging (Paperback)
Cher Ming Tan
,
Preetpal Singh
R
4,179
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Electromigration Modeling at Circuit Layout Level (Paperback, 2013 ed.)
Cher Ming Tan
,
Feifei He
R
1,883
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