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Springer International Publishing AG
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R
427
Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs (Hardcover, 2014 ed.)
Brandon Noia
,
Krishnendu Chakrabarty
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R
4,013
R
3,586
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R
157
Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs (Paperback, Softcover reprint of the original 1st ed. 2014)
Brandon Noia
,
Krishnendu Chakrabarty
List Price
R
2,853
R
2,696
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